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Japan Electronic Materials Corporation (JEM) is a world leader in Probe Card manufacturing. Since 1970, JEM
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Group has supplied Probe Cards to leading semiconductor manufacturers worldwide. We develop proprietary Probe Cards for high-integration and high-speed devices, drawn on our integrated knowledge and innovative unique technologies, including materials, processes, structure and mechanical designs.
JEM manufacture a diversified line of probing products: Cantilever, Vertical and Special Applications Probe Cards. Our Probe Cards are used in technologies such as Linear, Memory, Gate Array, Microprocessor, Power IC, ASIC, LCD Driver, Thermal Head, Diode, Optical IC, ECL and GaAs.
JEM has been aggressively expanding its overseas business through its established worldwide production bases. Currently, JEM has sales and manufacturing facilities in Japan, US, Europe, Korea, China, Taiwan and Vietnam.
More information can be found on our website at www.jem-net.co.jp and www.jemam.com |
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| JEM has been specializing in Cantilever Probe Card for Memory and Logic for over 25 years. Cantilever Probe Card is a robust, cost-effective probing solution for applications such as high parallelism, fine pitch, parametric testing, etc. The quality of JEM Cantilever Probe Card has excellent reputation in the industry, and one of the contributing factors is the quality of their probe card design. Our designers conduct probe spacing and gram force analysis as well as simulation of probe card warpage, due to high temperature and high probe force, to achieve optimized probe geometries. These analyses are imperative in ensuring uniform probe force, contact resistance and scrub mark. |
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| [ Multi-dut Probe Card ] |
| Multi-Dut Probe Card allow our customers to make full use of the advanced ATE performance, leading to significant reduction in test time and test costs. JEM has capability to build probe cards up to 81 Duts with probe count exceeding 3000 probes, as well as multi-dut cards with large array sizes and flexible configurations. We have patented the step ring design for high-parallelism cards. This design allows uniform contact force between the inner & outer rows, and enables use of uniform probe diameter. |
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Multi-dut Probe Card
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| [ Logic Shelf Probe Card ] |
| Logic Shelf Probe Card is a more efficient probing approach for logic devices and it is recommended for devices with peripheral pads. Based on the existing cantilever technology, the Logic Shelf Probe Card features a bridge construction and a unique probe layout. Compared to the conventional diagonal quad configuration, the bridge construction offers more consistent scrub marks and balanced contact force, while the unique probe layouts results in higher test productivity. With fewer touchdowns required, test time will be shortened and throughput will be increased, contributing to lower cost of ownership. 1x2 and 2x2 configurations are available and other configurations maybe available upon request. |
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Logic Shelf Probe Card
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| [ CP-Series (Cantilever Parametric) Probe Card ] |
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CP-Series Probe Card enables high-precision parametric measurements with extremely low leakage current. When used in conjunction with a high-precision test system, the resulting leakage current can be as low as 1fA at 1VDC. The CP-Series Probe Card structure also reduces the capacitance to level which is much lower than the typical probe cards. For outgoing QA testing, JEM use specialized measurement equipment from Agilent and Keithley to measure the leakage of each probe. Currently, JEM is an approved probe card vendor for the following parametric test systems:
• Agilent 4062 / 4071 / 4073 Parametric Test System
• Keithley S600 / S630 Parametric Test System
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CP-Series Probe Card for Agilent 4062 |
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CP-Series Probe Card for Agilent 4071 |
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CP-Series Probe Card for Agilent 4073 |
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CP-Series Probe Card for Keithley S600 |
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JEM offers a diverse line of Vertical Probe Cards suitable for a wide spectrum of probing applications. We are confident to provide a number of performance benefits that are unattainable in the conventional cantilever probe cards. Combining breakthroughs in the interconnect technology and precision manufacturing techniques, JEM Vertical Probe Cards provide a reliable and cost-effective solution for the next-generation devices and high parallelism testing for 300mm-wafers.
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| [ VC-Series Probe Card ] |
• Multi-die Memory Probing
• Multi-die Logic Device Probing
• Wafer Level Burn-in |
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VC-Series Probe Card
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| [ VS-Series Probe Card ] |
• Area Array Probing
• C4 Probing
• Solder or Copper Bump Probing |
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VS-Series Probe Card
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| [ VE-Series Probe Card ] |
| • Image Sensor Devices |
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VE-Series Probe Card
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• CEN-Series Probe Cards
• High Current
• High Density
• High Speed
• Ultra Fine Pitch
• Wafer Level Burn-in |
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Special Applications Probe Card
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| For further information, please contact: |
| Hy-Cad Systems & Engineering Pte Ltd |
| Tel |
: +65 6288 6123 |
| Fax |
: +65 6288 6496 |
| Email |
: info@hy-cad.com |
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Last update on 27/01/2010
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